ACM Research Inc. together with its subsidiaries develops manufactures and sells capital equipment in Mainland China and internationally. It also develops manufactures and sells a range of packaging tools to wafer assembly and packaging customers. The company provides wet cleaning equipment for front end production processes; electrochemical plating furnace PECVD and track platforms; Space Alternated Phase Shift technology for flat and wafer surfaces; timely energized bubble oscillation technology for patterned wafer surfaces at advanced process nodes; and Tahoe technology; and semi-critical cleaning tools. It also offers advanced packaging equipment such as coaters developers photoresist strippers scrubbers wet etchers and copper-plating equipment; and advanced packaging products include: Ultra ECP ap which delivers a uniform metal layer to finished wafers prior to packaging; Ultra C Developer which applies liquid developer to selected parts of photoresist to resolve an image; Ultra C PR Megasonic-Assisted Stripper which removes photoresist; Ultra C Scrubber which scrubs and cleans wafers; Ultra C Thin Wafer Scrubber which addresses a sub-market of cleaning very thin wafers for certain Asian assembly factories; and Ultra C Wet Etcher which etches silicon wafers and copper and titanium interconnects. In addition the company provides ECP technology for advanced metal plating; Ultra fn Furnace a dry processing tool; Ultra Pmax PECVD tools a proprietary designed chamber gas distribution unit and chuck; and Ultra Track a 300mm process tool that delivers uniform air downflow fast robot handling and configurable software to address specific customer requirements. It markets and sells its products under the SAPS TEBO ULTRA C ULTRA Fn Ultra ECP Ultra ECP map and Ultra ECP ap trademarks through direct sales force and third-party representatives. ACM Research Inc. was incorporated in 1998 and is headquartered in Fremont California.