ACM Research Inc. together with its subsidiaries develops manufactures and sells capital equipment worldwide. It also develops manufactures and sells a range of packaging tools to wafer assembly and packaging customers. The company provides Wet Cleaning Equipment for Front End Production Processes; Ultra C SAPS II and Ultra C SAPS V which are a single-wafer serial-processing tool used to remove random defects from wafer surfaces or interconnects and barrier metals as part of the chip front-end fabrication process or for recycling test wafers; and Ultra C TEBO II and Ultra C TEBO V a single-wafer serial-processing tool used at numerous manufacturing processing steps for cleaning of chips at process nodes of 28nm or less. In addition it offers Ultra-C Tahoe wafer cleaning tool that delivers high cleaning performance using significantly less sulfuric acid and hydrogen peroxide than is typically consumed by conventional high-temperature single-wafer cleaning tools; and advanced packaging tools such as coaters developers photoresist strippers scrubbers wet etchers and copper-plating tools. Further the company provides e Ultra fn Furnace a dry processing tool; Ultra Pmax™ PECVD tool for film uniformity; Ultra Track tool a 300mm process tool that delivers air downflow robot handling and customizable software to address specific customer requirements; and a suite of semi-critical cleaning systems which include single wafer back side cleaning scrubber and auto bench cleaning tools. It markets and sells its products under the SAPS TEBO ULTRA C ULTRA Fn Ultra ECP Ultra ECP map and Ultra ECP ap trademarks through direct sales force and third-party representatives. ACM Research Inc. was incorporated in 1998 and is headquartered in Fremont California.